文章摘要
低轮廓电解铜箔表面微细粗化工艺研究
Surface Micro-coarsening Technology for Low-profile Electrolytic Copper Foil
Received:May 20, 2024  
DOI:10.3969/j.issn.1674-6457.2024.07.015
中文关键词: 电解铜箔  微细粗化处理  针状多面体  粗糙度  剥离强度
英文关键词: electrolytic copper foil  micro-coarsening treatment  needle-like polyhedron  roughness  stripping strength
基金项目:国家重点研发计划(2021YFB3400800);河南省科技研发计划联合基金重点项目(225200810026);河南省重点研发专项(231111241000);河南省中原学者工作站资助项目(224400510025)
Author NameAffiliation
LING Yu College of Chemistry and Chemical Engineering,School of Materials Science and Engineering, Henan University of Science and Technology, Henan Luoyang 471023, China
Henan Key Laboratory of Nonferrous Metal Materials Science and Processing Technology, Henan Luoyang 471023, China 
LU Weiwei College of Chemistry and Chemical Engineering,School of Materials Science and Engineering, Henan University of Science and Technology, Henan Luoyang 471023, China
Henan Key Laboratory of Nonferrous Metal Materials Science and Processing Technology, Henan Luoyang 471023, China 
SONG Kexing College of Chemistry and Chemical Engineering,School of Materials Science and Engineering, Henan University of Science and Technology, Henan Luoyang 471023, China
Henan Key Laboratory of Nonferrous Metal Materials Science and Processing Technology, Henan Luoyang 471023, China 
LIU Haitao College of Chemistry and Chemical Engineering,School of Materials Science and Engineering, Henan University of Science and Technology, Henan Luoyang 471023, China
Henan Key Laboratory of Nonferrous Metal Materials Science and Processing Technology, Henan Luoyang 471023, China 
WU Yuying School of Materials Science and Engineering, Shandong University, Jinan 250061 China 
YANG Xiangkui Shandong Jinbao Electronics Co., Ltd., Shandong Zhaoyuan 265400, China 
FAN Binfeng Henan High Precision Copper Foil Industry Technology Research Institute Co., Ltd., Henan Lingbao 472500, China 
WANG Qingfu Henan High Precision Copper Foil Industry Technology Research Institute Co., Ltd., Henan Lingbao 472500, China 
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中文摘要:
      目的 针对低轮廓电解铜箔剥离强度不足的问题,进行铜箔表面微细粗化处理研究,通过在铜箔表面生成可控形态的针状结构粗化层,以期在不影响低轮廓铜箔表面整体轮廓的条件下,提高铜箔的抗剥离性能。方法 采用电化学微细粗化法,以NaOH和K2S2O8的混合溶液为粗化电解液,研究电流密度、NaOH浓度及K2S2O8浓度等主要工艺参数对铜箔表面针状结构形貌、粗糙度及铜箔剥离强度的影响。结果 经过微细粗化处理后,低轮廓电解铜箔表面形成了针状多面体结构,在粗化电流密度为1.5 A/dm2、粗化液中NaOH质量浓度为100 g/L、K2S2O8质量浓度为20 g/L的条件下,粗化层形成的针状多面体结构致密且均匀,铜箔的剥离强度提升至0.48 N/mm。结论 通过电化学微细粗化法,在低轮廓电解铜箔表面成功制备了针状结构的粗化层,通过优化微细粗化工艺参数,实现了铜箔表面针状结构粗化层的可控制备,在保证铜箔低表面粗糙度的同时,有效提高了铜箔的剥离强度。
英文摘要:
      To solve the problem of insufficient stripping strength of low-profile electrolytic copper foil, the work aims to carry out micro-coarsening treatment of copper foil surface to improve the stripping resistance of copper foil without affecting the overall profile of the low-profile copper foil surface by generating a controllable needle coarsening layer on the surface of copper foil. With the mixed solution of NaOH and K2S2O8 as the coarsening electrolyte, the effects of main process parameters such as current density, NaOH concentration and K2S2O8 concentration on the morphology of needle structure, roughness and stripping strength of copper foil were studied by electrochemical micro-coarsening method. After micro-coarsening treatment, needle-like polyhedron was formed on the surface of low-profile electrolytic copper foil. Under the conditions of coarsening current density of 1.5 A/dm2, NaOH concentration of 100 g/L and K2S2O8 concentration of 20 g/L in coarsening liquid, the needle-like polyhedral structure formed in the roughened layer was dense and homogeneous, and the stripping strength of copper foil increased to 0.48 N/mm. By exploring the effect of micro-coarsening process parameters on the surface morphology and stripping strength of copper foil, the optimum micro-coarsening process parameters are determined, and the controlled preparation of the coarsening layer of needle structure on the surface of copper foil is realized. The stripping strength of copper foil is effectively improved and the low surface roughness is guaranteed at the same time.
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