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| 直流电作用下Cu在Sn熔体中的溶解动力学以及界面反应 |
| Dissolution Kinetics and Interfacial Reactions of Cu in Molten Sn under Direct Current |
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| DOI：10.3969/j.issn.1674-6457.2022.12.023 |
| 中文关键词: 直流电 电迁移 溶解动力学 界面反应 |
| 英文关键词: direct current electromigration dissolution kinetics interfacial reactions |
| 基金项目:国家自然科学基金(51605042) |
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| 中文摘要: |
| 目的 在微观尺度上解析直流电场对金属液/固界面溶解动力学和界面反应的本征影响。方法 在237~312 ℃温度范围内对电流作用下Cu/Sn/Cu液固界面进行显微结构的表征及溶解动力学的计算。结果 施加直流电时，Cu的溶解速率在阴极端显著增大，而在阳极端则受到抑制。相应地，由于Cu的迁移速度较快，大量阴极Cu迁移至阳极端，使其附近形成大量的金属间化合物。计算了10 A电流作用下阴极Cu的溶解激活能，其数值约为不通电流情况下的一半。结论 直流电的施加显著降低了Cu在Sn熔体中的溶解激活能，而电迁移力是促进Cu扩散的主要原因。 |
| 英文摘要: |
| The work aims to analyze the intrinsic effect of direct current electric field on the solution kinetics and interfacial reactions of liquid/solid metal interface at microcosmic scale. The microstructure of Cu/Sn/Cu liquid-solid interface was characterized and the dissolution kinetics was calculated under the action of electric currentin the temperature range of 237-312 ℃. The results show that the dissolution rate of the cathode Cu presents a marked increase, contrarily to the anode substrates when applying the direct current. Correspondingly, due to the rapid migration rate of Cu, a large number of cathode Cu migrates to the anode extreme, which leads to the formation of a mass of intermetallic compounds nearby. The dissolution activation energy of the cathode Cu under the current of 10 A was calculated and the value appears to be about half of that under the absence of current. The dissolution activation energy of Cu in molten Sn is significantly reduced by the application of direct current, and the electromigration force is the primary cause to promote the diffusion of Cu. |
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