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| 两种铝/钢组合（1060/Q235和1060/SUS304）的搅拌摩擦钎焊组织与性能对比研究 |
| Comparative Study of Aluminum/Steel Dissimilar Couples (1060/Q235 and 1060/SUS304) Friction Stir Brazing Microstructure and Properties |
| Received:November 20, 2019 Revised:January 10, 2020 |
| DOI：10.3969/j.issn.1674-6457.2020.01.006 |
| 中文关键词: 搅拌摩擦焊 搅拌摩擦钎焊 金属间化合物 去膜 |
| 英文关键词: friction stir welding (FSW) friction stir brazing (FSB) intermetallic compound oxide film removal |
| 基金项目:陕西省科技成果转移与推广计划-吸纳成果转化项目（2019CGXNG-026）；西安交通大学材料表面技术创新团队资助项目（xtr0118008） |
| Author Name | Affiliation | | YANG Xiao-hui | School of Material Science and Engineering, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China | | ZHANG Gui-feng | School of Material Science and Engineering, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China | | ZHANG Jian-xun | School of Material Science and Engineering, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China |
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| 中文摘要: |
| 目的 研究搅拌摩擦钎焊对强度高、去膜难的不锈钢基板的机械去膜能力以及添加钎料的必要性。方法 对1060/Q235和1060/SUS304两种组合，采用大直径（40 mm）的无针搅拌头，对比有无钎料情况下的接头组织与性能，研究搅拌摩擦钎焊的去膜机制以及钎料对界面组织与性能的影响。结果 搅拌摩擦钎焊后的1060/Q235和1060/SUS304两种组合，分别形成13 μm与5 μm厚的IMC层；Al/Q235组合仅在中心区域未出现裂纹，但在边缘的前进侧与后退侧分别出现了长达12 mm与9 mm的平行于界面的裂纹；虽然Al/SUS304组合界面IMC厚度薄，但出现平行于界面裂纹（整个宽度范围内）和垂直于界面的裂纹。结论 搅拌摩擦钎焊借助大轴肩对两种组合都具有优良的机械去膜能力；Zn钎料的添加可进一步加速IMC的生长，Al/SUS304组合对热应力更敏感，应采用低拘束与低热输入方案。 |
| 英文摘要: |
| The paper aims to confirm the mechanical removal oxide film ability of FSB on stainless steel substrates with high strength and difficultoxide film removal, and the necessity of solder. For the two couples of 1060/Q235 and 1060/SUS304, a large-diameter (40 mm) needle-free stirring head was used to compare the structure and performance of the joint with and without solder, to study the film removal mechanism of the FSB and the influences of solder on the interface and performance. After FSB, IMC layers with a thickness of 13 μm and 5 μm, respectively formed on the two couples of 1060/Q235 and 1060/SUS304. The cracks only appeared in the center of Al/Q235 couple, but cracks parallel to the interface of 12 mm and 9 mm appeared on the advancing side and the retreating side of the edge respectively. Although the IMC of the Al/SUS304 composite interface was thin, cracks parallel to the interface (over the entire width) and perpendicular to the interface appeared. FSB has excellent mechanical film-removal capabilities for both couples with the help of large shoulders; the addition of Zn solder can further accelerate the growth of IMC, and the Al/SUS304 combination is more sensitive to thermal stress, and a low restraint and low heat input scheme should be used. |
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