文章摘要
模具水路水密性检测装置开发
Development of Water Tightness Testing Device for Mold and Waterway
Received:November 08, 2018  Revised:March 10, 2019
DOI:10.3969/j.issn.1674-6457.2019.02.012
中文关键词: 热成形  模具水路  水路密封性
英文关键词: hot forming  mold waterway  waterway tightness
基金项目:
Author NameAffiliation
HE Xin Shanghai Superior Die Technology Co., Ltd., Shanghai Engineering Research Center of Advanced Automotive Body Manufacturing, Shanghai 201209, China 
LI Xiao-chen Shanghai Superior Die Technology Co., Ltd., Shanghai Engineering Research Center of Advanced Automotive Body Manufacturing, Shanghai 201209, China 
Hits: 4262
Download times: 3160
中文摘要:
      目的 简化热成形模具水路密封性的检测方法,减少人力、设备、时间成本。方法 开发制造一种模具水路密封性检测装置,模拟生产设备冷却系统环境,检测热成形模具水路的水密性以及对模具水路中的杂质进行清洗。结果 检测装置可以对模具水路循环系统的流速和流量进行监控,对模具水路密封性进行检测,缩短模具制造周期,提高制造成本。结论 装置实现了前期对模具水路密封性检测的需求,简化了模具水路密封性检测的过程,释放了原有设备产能,减少了人力、设备、时间成本,达到了装置开发的目的。
英文摘要:
      The paper aims to simplify the testing method of waterway tightness of thermoforming die, reduce the cost of manpower, equipment and time. Mold and waterway tightness detection device was developed and manufactured to simulate the cooling system environment of production equipment, test the water tightness of hot forming mold waterway and clear the impurities in the mold waterway. The detection device could monitor the flow rate of the water circulation system of the die, inspect the tightness of the water circulation system of the die, shorten the manufacturing cycle of mold and increase the manufacturing cost. The device realizes the requirement of waterway tightness test of mold in the early stage, simplifies the process of waterway tightness test of mold, releases the capacity of original equipment, reduces the cost of manpower, equipment and time, and achieves the purpose of device development.
View Full Text   View/Add Comment  Download reader
Close

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

You are the502375visitor    渝ICP备15012534号-6

>Copyright:Journal of Netshape Forming Engineering 2014 All Rights Reserved

>Postal Code: Phone:Fax: Email:

>    

渝公网安备 50010702501719号