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| 激光前向转移技术及其温度场数值模拟研究 |
| Laser-Induced Forward Transfer Technology and Its Numerical Simulation of Temperature Field |
| Received:November 16, 2017 Revised:January 10, 2018 |
| DOI：10.3969/j.issn.1674-6457.2018.01.006 |
| 中文关键词: 激光 前向转移 温度场 数值模拟 |
| 英文关键词: laser forward transfer temperature field numerical simulation |
| 基金项目:国家自然科学基金(51375003) |
| Author Name | Affiliation | | LIU Wei | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China | | FEI Yi-kun | Shanghai Aerospace Control Technology Institute, Shanghai 201199, China | | ZHENG Zhen | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China | | AN Rong | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China | | ZHANG Wei | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China | | WANG Chun-qing | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China | | TIAN Yan-hong | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China | | ZHU Min-xi | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China |
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| 中文摘要: |
| 激光具有加工重复性好、能量精确控制及加工精度高等优点，其加工对象的尺寸可以达到微米甚至是亚微米级，可实现三维空间结构高精度加工。激光因其具备上述优异的性能，被应用于材料加工。激光能量还被用来诱发物质向特定方向转印，此类技术也被称为激光前向转移技术。主要综述了激光前向转移技术的实现过程、原理及微观机制，着重介绍并分析了激光前向转印技术发展的历史及其应用现状，如金属Cu, Cr, Al等金属薄膜的转印、单壁碳纳米管转印键合、微纳米结构的加工、元件异质集成等。最后对激光前向转移技术的温度场仿真的研究现状进行了分析和总结，具体包括仿真的方法、模型的使用等。 |
| 英文摘要: |
| Laser is featured with strong processing repeatability, precise energy control, high machining precision, etc. Its processing object can achieve micron, even sub-micron size, which can realize high resolution processing of 3D structures. Because of its excellent performance, laser is applied to material processing. It is also used to abate, induce transfer and deposition material in specific orientation, and this technique is also known as the LIFT-Laser Induced Forward Transfer Technology. This paper mainly summarized the implementation process, principle and microcosmic mechanism, development history and application status of laser forward transfer technology, such as Cu, Cr, Al metal film transfer, single-walled carbon nanotubes transfer and bonding, the manufacturing of micro/nano structure, heterogeneous integration of electronic devices, etc. Before the end of this paper, research status of temperature field simulation for laser forward transfer technology was analyzed and summarized, including the simulation methods, the use of the model, etc. |
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