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| 基于石墨烯特征制备新型柔性石墨膜的研究进展 |
| Preparation and Development of New Flexible Graphite Films Based on Graphene Characteristics |
| Received:August 15, 2017 Revised:September 10, 2017 |
| DOI：10.3969/j.issn.1674-6457.2017.05.016 |
| 中文关键词: 石墨片 聚酰亚胺薄膜 高导热 结构与性能 |
| 英文关键词: graphite flake polyimide film high-thermal conductivity structure and property |
| 基金项目:国家自然科学基金（51573087）；山东省自然科学基金（ZR2014EZ001） |
| Author Name | Affiliation | | MA Lian-ru | Key Laboratory for Liquid-Solid Structural Evolution & Processing of Materials, Ministry of Education, Shandong University, Jinan 250061, China | | WANG Yan-xiang | Key Laboratory for Liquid-Solid Structural Evolution & Processing of Materials, Ministry of Education, Shandong University, Jinan 250061, China | | WANG Yao-yao | Key Laboratory for Liquid-Solid Structural Evolution & Processing of Materials, Ministry of Education, Shandong University, Jinan 250061, China | | SU Shun-sheng | Key Laboratory for Liquid-Solid Structural Evolution & Processing of Materials, Ministry of Education, Shandong University, Jinan 250061, China |
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| 中文摘要: |
| 石墨材料具有密度低、热膨胀系数低和热导率较高等优点，是近年来最具有发展前景的导热材料。主要综述了聚酰亚胺薄膜制备高导热新型柔性石墨膜的研究进展，并结合笔者的研究对形成石墨膜过程中存在的问题进行了简要分析。在此基础上着重综述了碳化和石墨化过程中化学结构的变化，薄膜由无序堆积结构转变成类石墨结构，其导电和导热性显著提高。综述了温度变化导致结构变化，从而对薄膜导电导热型产生影响的研究进展。这种新型薄膜在电子封装和国防工业等诸多领域都有极大的应用前景，薄膜对于该领域的前景和发展都具有重要的科学意义和应用价值。 |
| 英文摘要: |
| Graphite material has the advantages of low density, low thermal expansion coefficient and high thermal conductivity. It is the most promising thermal conductive material in recent years. In this paper, the development of new flexible graphite film with high thermal conductivity prepared by polyimide film is reviewed, and the problems existing in the process of forming graphite film are briefly analyzed. On this basis, the change of chemical structure in the process of carbonization and graphitization is emphatically summarized. The film is changed from disordered structure to graphite structure, and its conductivity and thermal conductivity is improved remarkably. The research progress of the influence of temperature change on the structure of conductive and thermal conductivity is reviewed. This new type of film has great potential in many fields, such as electronic packaging and national defense industry. The film has important scientific significance and practical value for the future and development of this field. |
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