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| 金属基复合材料半固态模锻连接一体化成形技术 |
| Metal Matrix Composites Die Forging and Connection Integration Technology in Semisolid State |
| Received:March 10, 2015 Revised:May 10, 2015 |
| DOI：10.3969/j.issn.1674-6457.2015.03.004 |
| 中文关键词: 金属基复合材料 半固态 模锻成形 连接 一体化 |
| 英文关键词: metal matrix composites semisolid state die forging connection integration technology |
| 基金项目:国家自然科学基金(51175018);中央高校基本科研业业务费专项资金资助(HIT. NSRIF.2010118);哈尔滨市科技创新人才研究专项资金(2012RFQXG105);上海航天科技创新基金(SAST201332) |
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| 中文摘要: |
| 随着金属基复合材料工业化的应用越来越广,金属基复合材料的连接越来越受到人们的重视。尤其对于电子封装材料而言,增强体分率一般较高,而且要求其密封性和致密性,同时还要求具有良好的连接性能。针对此种情况,根据半固态工艺“固液”良好的扩散性和充填性,提出了金属基复合材料半固态模锻成形与连接一次性整体成形工艺方法,并实现近净成形,为金属基复合材料制件的制备和连接提供了一条新途径。 |
| 英文摘要: |
| As the industrial application of metal matrix composites is more and wider, about the connection of metal matrix composites has attracted more and more attention, especially for electronic packaging materials, fraction of reinforce- ment is normally higher, and requires its sealing and compactness. At the same time it also requires a good connection performance. For these reasons, according to the semi-solid process being with good diffusivity and filling during "solid liquid" state, the authors put forward the metal matrix composites die forging forming in semisolid state technology. The forming process and connecting procedures are finished at one-time and realizes near net shaping. It provides a new way for the preparation of metal matrix composites and connection. |
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