文章摘要
高频/ 超声振动辅助微成形技术研究进展与展望
Research Progress and Outlook of High-frequency / ultrasonic Vibration Assisted Microforming
Received:March 16, 2015  Revised:May 10, 2015
DOI:10.3969/j.issn.1674-6457.2015.03.002
中文关键词: 高频/ 超声振动  微成形  力学行为  作用机制
英文关键词: high-frequency/ ultrasonic vibration  microforming  mechanical properties  mechanism
基金项目:国家自然科学基金(51375113)
Author NameAffiliation
WANG Chun-ju School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China 
GUO Bin School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China 
SHAN De-bin School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China 
ZHANG Man-man School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China 
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中文摘要:
      微机电系统等技术的快速发展,给微成形技术提供了强大的发展动力。主要综述了体积微成形、箔板微成形以及微成形介观尺度效应等3 个方面的研究进展,并结合作者的研究经历对微成形研究中存在的问题进行了简要分析。在此基础上,着重综述了高频/ 超声振动作用下材料的力学行为,介绍了材料变形抗力降低的主要原因,即应力叠加、声波软化及摩擦力降低,并从体积效应和表面效应两个方面对其作用机制进行了概述。进而综述了高频/ 超声振动在微冲裁、微挤压以及微拉深等微成形工艺中应用的研究进展,介绍了高频/ 超声振动的积极效果。最后,对该方向的研究进展进行了总结,并对其发展前景和主要发展方向进行了展望。
英文摘要:
      Rapid development of micro electro mechanical systems provides strong power for the development of microforming. This paper mainly reviews the research progress on micro bulk forming, micro sheet forming and mesoscale effects, and gives the analysis of the current problems in investigation of the microforming based on authors'experience. Then, mechanical properties of materials under high-frequency/ ultrasonic vibration is reviewed, and the main explanation of force reduction is introduced, which are stress superposition, acoustic softening and reduction of friction. and, its mechanism is reviewed from two aspects: bulk effect and surface effect. Following that, application of high-frequency/ ultrasonic vibration is reviewed in micro blanking, micro extrusion and micro deep drawing, and its positive effect is introduced. Finally, the progress of the investigations is summarized, and the outlook of its future development prospects and main direction is given.
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