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| 微量P 对Sn-0. 7Cu 无铅钎料高温抗氧化性能的影响 |
| Influence of Trace P on the High-temperature Oxidation Resistance of Sn-0. 7Cu Lead-free Solder |
| Received:January 16, 2015 Revised:March 10, 2015 |
| DOI：10.3969/j.issn.1674-6457.2015.02.008 |
| 中文关键词: 无铅钎料 Sn-0. 7Cu 抗氧化性 微量P |
| 英文关键词: lead-free solder Sn-0. 7Cu oxidation resistance trace P |
| 基金项目:重庆理工大学研究生创新基金重大项目(YCX2013101;YCX2014215);重庆理工大学科研启动基金(2012ZD12);重庆市教委/ 科技研究一般项目(KJ130813) |
| Author Name | Affiliation | | WANG Qing-meng | Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of Technology), Chongqing 400054, China | | WANG Huai-shan | Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of Technology), Chongqing 400054, China | | MENG Guo-qi | Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of Technology), Chongqing 400054, China | | LUO Hu | Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of Technology), Chongqing 400054, China | | GAN Gui-sheng | Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of Technology), Chongqing 400054, China |
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| 中文摘要: |
| 目的 研究了微量P 元素的添加,对Sn-0. 7Cu 无铅钎料在高温条件下抗氧化性能的影响。方法 制备了Sn-0. 7Cu 和Sn-0. 7Cu-xP 钎料合金,在250 ~370 ℃温度下,采用目测?旌捅砻婀卧?研究了熔融钎料在高温下的抗氧化性能。结果 微量P 元素能显著提高熔融Sn-0. 7Cu 钎料低温下的抗氧化性能,低温下P 含量为0. 009% 时抗氧化性能最好,当温度超过340 ℃时,抗氧化性能减弱,超过370 ℃时完全失去抗氧化效果。结论 在250 ℃时,Sn-0. 7Cu 钎料的氧化膜生长系数k250 ℃=1. 59×10-6,约为Sn-0. 7Cu-0. 009P 的3 倍,在370 ℃时,Sn-0. 7Cu 钎料的氧化膜生长系数k370 ℃=3. 03×10-6,与Sn-0. 7Cu-0. 009P 的相差不大。 |
| 英文摘要: |
| The aim of this study was to investigate the effects of adding trace P elements on the high-temperature oxidation resistance of Sn-0. 7Cu lead-free solder. Sn-0. 7Cu and Sn-0. 7Cu-xP solder alloys were prepared to investigate the influence of trace P on liquid Sn-0. 7Cu lead-free solder in the temperature range of 250 ~370 ℃. The oxidation resistance at high temperature was evaluated by visual observation and surface skimming. The results showed that trace P could significantly improve the oxidation resistance of Sn-0. 7Cu at low temperature and the optimal P content was 0. 009%. The oxidation resistance was weakened when the temperature was higher than 340 ℃and was completely lost when the temperature was over 370 ℃. The growth factor of oxide film on the surface of liquid Sn-0. 7Cu solder (k250 ℃=1. 59×10-6 ) was three times as high as that of Sn-0. 7Cu-0. 009P at 250 ℃, while the growth factor of oxide film on the surface of liquid Sn-0. 7 Cu solder at 370 ℃was very similar to that of the Sn-0. 7Cu-0. 009P solder. |
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