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| 纳米Ni 颗粒对焊锡膏的界面IMC 影响 |
| Influence of Ni Nanoparticle on the Interfacial Intermetallic Compounds of Solder Paste |
| Received:June 10, 2014 Revised:November 10, 2014 |
| DOI：10.3969/j.issn.1674-6457.2014.06.020 |
| 中文关键词: 纳米Ni 焊锡膏 IMC |
| 英文关键词: Ni nanoparticles solders paste IMC |
| 基金项目: |
| Author Name | Affiliation | | WANG Tao | College of Mechanical and Electrical Engineering, Yangtze Normal University, Chongqing 408100, China | | GAN Gui-sheng | Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China | | HU Zhi-lan | Quality Management Department, Chongqing Qingling Motors Group Co. , Ltd. , Chongqing 400052, China | | TANG Ming | Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China |
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| 中文摘要: |
| 目的 研究纳米Ni 对SnAg0. 3Cu0. 7 无铅焊锡膏的焊点界面IMC 影响。方法 采用在助焊剂中添加纳米Ni 颗粒,制备出纳米Ni 颗粒增强的SnAg0. 3Cu0. 7 焊锡膏,分析纳米Ni 在150 ℃时效中对IMC 的影响。结果 在150 ℃时效中界面IMC 的厚度随着时效时间延长而增大,形貌变成平缓层状;添加Ni 质量分数为0. 025%时,对界面IMC 几乎无影响,当添加质量分数为0. 05%和0. 1%的纳米Ni 能促进IMC 的生长,但抑制Cu3Sn 层的生长。结论 通过添加纳米Ni 颗粒,在150 ℃时效中可促进IMC 的生长,抑制Cu3Sn 层的生长。 |
| 英文摘要: |
| Objective To investigate the effects of Ni nanoparticles addition on the interfacial intermetallic compounds of SnAg0. 3Cu0. 7 lead-free solder paste. Methods The nanoparticle reinforced SnAg0. 3Cu0. 7 paste was prepared by adding Ni nanoparticles in the flux. The influence of Ni nanoparticles on IMC aging at 150 ℃was analyzed. Results The study of interface IMC showed that during aging at 150 ℃, the thickness of interface IMC increased with prolonged aging time and the morphology was changed into a planar type structure. The morphology of IMC was basically unchanged when the mass fraction of Ni nanoparticles was 0. 025%. Moreover, the growth of IMC was enhanced while that of Cu3 Sn was suppressed when the mass fractions of Ni nanoparticles were 0. 05% and 0. 1%, respectively. Conclusion The growth of IMC was enhanced by adding Ni nanoparticles in the aging at 150 ℃, while the growth of Cu3 Sn layer was suppressed. |
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