|
| Sb,Bi 元素对 Sn-22 Sb 高温钎料合金组织的影响 |
| Effects of Sb and Bi on the Microstructure of Sn-22 Sb Solder Alloy |
| Received:March 04, 2014 Revised:May 01, 2014 |
| DOI：10.3969/j.issn.1674-6457.2014.03.011 |
| 中文关键词: 高温钎料 Sn-22 Sb 组织 熔化温度 |
| 英文关键词: high-temperature solder Sn-22Sb microstructure melting temperature |
| 基金项目:重庆市教委 / 科技研究一般项目( KJ130813) ;重庆理工大学科研启动基金(2012ZD12) |
| Author Name | Affiliation | | GAN Shu-de | School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China | | GAN Gui-sheng | School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China | | WANG Tao | College of Mechanical and Electrical Engineering, Yangtze Normal University, Chongqing 408100, China | | DU Chang-hua | School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China | | LI Hong-bo | Material Engineering College of Panzhihua University, Panzhihua 617000, China |
|
| Hits: 7573 |
| Download times: 6707 |
| 中文摘要: |
| 目的 研究 Sb 和 Bi 元素对 Sn-22 Sb 钎料显微组织的影响。 方法 制备了( Sn-22 Sb)-xBi和 Sn-xSb 钎料合金,并分别采用差热分析和 X 射线衍射仪,分析了材料的熔化特征和物相。 结果结果表明:Sn-22 Sb 钎料合金主要由灰色的 茁-Sn 和白色块状的 Sb2Sn3构成;少量的 Bi 使得 Sn-22 Sb 钎料合金中 Sb2Sn3金属间化合物逐渐细化和均匀化,数量却急剧增加;大量添加 Sb 后,使得Sn-22 Sb 钎料合金几乎全部变为粗大的块状 茁-SnSb 组织, 钎料合金的开始熔化温度有所提高。结论 通过添加其他合金元素,降低 Sn-50 Sb 钎料液相线温度,使其有望应用于二次回流焊。 |
| 英文摘要: |
| Objective To investigate the effects of Sb and Bi on the microstructure of Sn-22Sb Solder alloy. Methods ( Sn-22Sb)-xBi and Sn-xSb solder alloys were prepared. The melting behavior and phase were analyzed by differential scanning calorimetry ( DSC) and X-ray diffraction ( XRD) , respectively. Results Sn-22Sb solder alloy was mainly composed of gray 茁-Sn and white block Sb2Sn3. A small amount of Bi made the microstructure of Sb2Sn3intermetallic compound in Sn-22Sb solder alloy fine and homogenized. Thick massive 茁-SnSb could be found in Sn-50Sb solder alloy, and the initial melting temperature of Sn-50Sb solder alloy increased. Conclusion The liquidus temperature of the Sn-50Sb solder was reduced by adding other alloying elements, leading to possible application in secondary reflow soldering. |
|
View Full Text
View/Add Comment Download reader |
| Close |
|
|
|
渝公网安备 50010702501719号