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| 活性剂对 Sn-0 . 65 Cu 无铅钎料的 IMC 影响 |
| Effect of Activators on the Intermetallic Compounds in Sn-0 . 65 Cu Lead-free Solder |
| Received:May 30, 2012 Revised:December 01, 2012 |
| DOI：10.3969/j.issn.1674-6457.2013.01.009 |
| 中文关键词: 活性剂 Sn-0 . 65 Cu IMC |
| 英文关键词: activator Sn-0. 65Cu IMC |
| 基金项目: |
| Author Name | Affiliation | | WANG Tao | College of Material Science and Engineering, Chongqing Universty of Technology, Chongqing 400054, China | | GAN Gui-sheng | College of Material Science and Engineering, Chongqing Universty of Technology, Chongqing 400054, China | | ZHAO Hai-jian | College of Material Science and Engineering, Chongqing Universty of Technology, Chongqing 400054, China | | TANG Ming | College of Material Science and Engineering, Chongqing Universty of Technology, Chongqing 400054, China | | CAO Ming-ming | College of Material Science and Engineering, Chongqing Universty of Technology, Chongqing 400054, China |
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| 中文摘要: |
| 研究了几种活性剂作用下 Sn-0 . 65 Cu / Cu 的扩展率及焊点界面金属间化合物( IMC) 的形貌,探讨了活性剂的活性强弱与 IMC 厚度的关系。 结果表明,不同活性剂作用下 Sn-0 . 65 Cu / Cu 扩展率的大小顺序为:氢化松香>戊二酸>苹果酸>柠檬酸;在活性越强的活性剂作用下,液态钎料在 Cu 基板上越容易铺展,钎料的温度分布更均匀,加剧了 Sn 原子和溶解在液态钎料的 Cu 原子的热运动,Sn 原子与 Cu 原子反应结合的概率增大,导致生成的 IMC 层更厚。 |
| 英文摘要: |
| The spread rate and the morphology of the intermetallic compounds ( IMC) in Sn-0. 65Cu solder were studied under several kinds of activators. The relationship between the activity of activators and the thickness of IMC was discussed. The results have shown that the spread rate followed in a decreasing order: hydrogenated rosin>glutaric acid>malic acid>citric acid. Stronger the activity of activators, better the spreading of solders on the Cu-substrates, and the temperature distributions in molten solder were more evenly, which could result in accelerating of the diffusion of Sn atoms and Cu atoms in molten solder. The thickness of IMC was larger with increasing of combining Sn atoms with Cu atoms. |
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