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纳米 Ni 颗粒对 Sn0 . 65 Cu 亚共晶钎料润湿性和抗氧化性的影响 |
The Effcet of Nano-Ni Particles on the Wettability and Oxidation Resistance of Sn0 . 65 Cu Hypoeutectic Solder |
Received:July 12, 2012 Revised:December 01, 2012 |
DOI:10.3969/j.issn.1674-6457.2013.01.005 |
中文关键词: Sn0 . 65 Cu 亚共晶钎料 纳米 Ni 颗粒 润湿性 抗氧化性 |
英文关键词: Sn0. 65Cu hypo-eutectic solder nano-Ni particles wettability oxidation resistance |
基金项目: |
Author Name | Affiliation | HUANG Wen-chao | College of Material Science and Engineering,Chongqing Universty of Technology,Chongqing 400054,China | GAN Gui-sheng | College of Material Science and Engineering,Chongqing Universty of Technology,Chongqing 400054,China | TANG Ming | College of Material Science and Engineering,Chongqing Universty of Technology,Chongqing 400054,China | WANG Tao | College of Material Science and Engineering,Chongqing Universty of Technology,Chongqing 400054,China | CAO Ming-ming | College of Material Science and Engineering,Chongqing Universty of Technology,Chongqing 400054,China |
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中文摘要: |
在 Sn0 . 65 Cu 亚共晶钎料中掺入纳米 Ni 颗粒,研究其对钎料润湿性及抗氧化性的影响。 当w( Ni)= 0 . 1% 时润湿力最大,为 3 . 29 mN,润湿时间为 1 . 01 s。 随着 Ni 含量的增加( w( Ni ) <0 . 7% ) 润湿力逐渐减弱,润湿时间增加。 纳米 Ni 颗粒会增强钎料的抗氧化性,当 w( Ni) = 0 . 7% 时抗氧化性最好。 |
英文摘要: |
After nano-Ni particles were mixed to Sn0. 65Cu hypoeutectic solder, the wettability and oxidation resistance of solders were studied. When w( Ni) was 0. 1% , the maximum wetting force was 3. 29 mN and wetting time was 1. 01 s. The wetting force was gradually weakened and the wetting time increased by increasing the content of Ni ( w( Ni) <0. 7% ) . Nano-Ni particles enhanced the oxidation resistance of solders. when w( Ni) was 0. 7% , the oxidation resistance of solders was the best. |
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