文章摘要
高硅铝合金真空钎焊接头组织与性能测试研究
Microstructure and Properties' Testing of Hypereutectic Si-Al Alloy Vacuum Brazed Joint
Received:January 10, 2012  Revised:July 10, 2012
DOI：
中文关键词: 高硅铝合金  真空钎焊试验  接头显微分析
英文关键词: hypereutectic Si-Al alloy  vacuum brazing experiment  microstructure analysis of joint
基金项目:
Author NameAffiliation
CHEN Xiao-xiao School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009， China 
HOU Ling School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009， China 
XU Dao-rong School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009， China 
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中文摘要:
      选用Cu箔，Zn及BAl88SiMg片状钎料作为填充金属，采用真空加热方法进行高硅铝合金的钎焊连接，并对接头进行光学金相、显微硬度、扫描电子显微等测试、分析、研究。结果表明：3种钎料钎焊高硅铝合金，通过凝固、结晶等过程形成冶金结合，生成共晶体和固溶体组织，形成可靠的连接接头，外观良好。
英文摘要:
      Hypereutectic Si-Al Alloys were connected by vacuum soldering with the filler of BAl88SiMg, pure copper and zinc, and the joints of brazing were analyzed and research by optical microscope,Vickers and scanning electron microscopy. The results show that hypereutectic Si-Al alloys can be connected hard with the solid solution and eutectic by the process of solidification and crystallization with three brazing filler metals, and reliable joints with good surface are formed.
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