刘莉,徐望辉,刘锐哲,等.层间搅拌摩擦加工对电弧增材制造铝合金温度场与应力场影响研究[J].精密成形工程,2025,17(6):177-186. LIU Li,XU Wanghui,LIU Ruizhe,et al.Effect of Interlayer FSP on the Temperature and Stress Fields of WAAM Al Alloy[J].Journal of Netshape Forming Engineering,2025,17(6):177-186. |
层间搅拌摩擦加工对电弧增材制造铝合金温度场与应力场影响研究 |
Effect of Interlayer FSP on the Temperature and Stress Fields of WAAM Al Alloy |
投稿时间:2024-11-11 |
DOI:10.3969/j.issn.1674-6457.2025.06.019 |
中文关键词: 铝合金 电弧-搅拌摩擦加工复合增材 数值模拟 温度场 应力场 |
英文关键词: Al alloy WAAM-FSP hybrid additive manufacturing numerical simulation temperature field stress field |
基金项目:国家自然科学基金资助项目(52205341);广东省基础与应用基础研究基金(2021A1515110062);材料结构精密焊接与连接全国重点实验室开放课题资助(MSWJ-24Z05);广州市开发区国际科技合作项目(2023GH19) |
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中文摘要: |
目的 针对电弧增材制造铝合金缺陷多、晶粒粗大、力学性能低的难题,采用电弧-搅拌摩擦加工复合增材制造的新工艺,研究层间搅拌摩擦加工对电弧增材制造铝合金温度场与应力场的影响。方法 通过建立铝合金电弧(Wire and Arc Additive Manufacturing, WAAM)-搅拌摩擦加工(Friction Stir Processing, FSP)复合增材的热力耦合模型,对单独电弧增材制造和WAAM-FSP复合增材过程中的温度场和应力场进行对比,分析层间FSP对电弧增材制造铝合金温度场和应力场的影响。结果 在WAAM过程中,2319铝合金最高温度达到1 575 ℃;在堆积下一道次时,前一道增材层峰值温度超过2319铝合金的液相线,使增材层发生部分重熔。层间FSP使增材试样峰值温度由1 575 ℃升高至1 619 ℃,在第一层增材时,层间FSP使工件的温度升高至约395 ℃。后续电弧增材及层间FSP对已增材层产生的温升影响随层数的增加而降低。此外,引入层间FSP后,增材构件起弧端、基板与堆积层交界处的应力集中面积减小,使熔敷层内峰值应力值降低约20 MPa。结论 层间搅拌摩擦加工可降低增材工件的冷却速度以及温度梯度,同时层间FSP过程中产生的热力耦合作用使增材构件中的应力分布更均匀,解决了增材件中应力集中的问题。 |
英文摘要: |
Specific to the common problems such as many defects, coarse grains and low mechanical properties in aluminum alloy by arc additive manufacturing, the work aims to adopt a new technology of wire arc addictive manufacturing (WAAM) and friction stir processing (FSP) to study the effect of interlayer FSP on the temperature and stress fields of WAAM Al alloy. By establishing a thermo-mechanical coupling model of WAAM-FSP hybrid AM method, the temperature and stress fields during WAAM and WAAM-FSP process were studied for comparison, and the effect of interlayer FSP on the temperature and stress fields of WAAM aluminum alloy was analyzed. The maximum temperature of 2319 aluminum alloy during WAAM process reached 1 575 ℃. During deposition of the next layer, the peak temperature of the previous additive layer exceeded the liquidus line of the 2319 aluminum alloy, causing the additive layer to partially remelt. The peak temperature of the additive specimen increased from 1 575 ℃ to 1 619 ℃ by the interlayer FSP. In addition, the temperature of the firstly deposited layer reached around 395 ℃ after interlayer FSP. The effect of subsequent WAAM process and interlayer FSP on the temperature rise of the additive layers decreased with the increase of the number of layers. Secondly, by introducing interlayer FSP, the stress concentration area between the deposited layers and the substrate was reduced, and the peak stress in the deposited layer was reduced by about 20 MPa. The interlayer FSP can decrease the cooling rate and temperature gradient of aluminum alloy produced by WAAM. At the same time, the thermal-mechanical coupling in the process of interlayer FSP makes the stress distribution in the additive more uniform, which solves the problem of stress concentration in the additive. |
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