张瑜,张宏强,梅寒,等.Ag基钎料钎焊SiCf/SiC复合材料异质接头组织性能研究[J].精密成形工程,2025,17(5):113-122.
ZHANG Yu,ZHANG Hongqiang,MEI Han,et al.Microstructure and Properties of SiCf/SiC Heterogeneous Joints Brazed with Ag-based Filler[J].Journal of Netshape Forming Engineering,2025,17(5):113-122. |
| Ag基钎料钎焊SiCf/SiC复合材料异质接头组织性能研究 |
| Microstructure and Properties of SiCf/SiC Heterogeneous Joints Brazed with Ag-based Filler |
| 投稿时间：2024-09-19 |
| DOI：10.3969/j.issn.1674-6457.2025.05.013 |
| 中文关键词: 钎焊 SiCf/SiC复合材料 镍基高温合金 微观组织 力学性能 |
| 英文关键词: brazing SiCf/SiC composites nickel-based superalloy microstructure mechanical properties |
| 基金项目:国防基础科研计划(JCKY2023601C018) |
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| 摘要点击次数: 55 |
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| 中文摘要: |
| 目的 解决SiCf/SiC复合材料与镍基高温合金异质钎焊接头中相容性差、组织反应复杂的问题。方法 采用多种Ag基钎料实现了SiCf/SiC复合材料的同质与异质钎焊连接。通过SEM与热力学计算探究了不同钎料对异质钎焊接头微观组织与剪切性能的影响，揭示了异质接头组织及物相的调控机理。结果 通过对接头微观组织进行多界面表征分析，对比分析了同质与异质接头组织的差异，揭示了活性元素Ti对SiCf/SiC复合材料接头微观组织的调控作用。AgCuTi钎料钎焊异质接头形成了TiC层，实现了SiCf/SiC复合材料侧薄弱界面的强化，该接头微观组织均匀且无缺陷。AuCuPd钎料钎焊异质接头因Ni、Si、Pd元素的剧烈反应而导致接头存在较多脆性相与裂纹。AgCuTi钎料钎焊异质接头的强度达59 MPa，是AgCuPd的2倍，且与同质接头强度相近。结论 活性元素Ti的添加有效改善了SiCf/SiC复合材料的润湿性及异质界面连接性，接头微观组织均匀、接头性能较高。 |
| 英文摘要: |
| The work aims to solve the problems of poor compatibility and complex microstructure reaction in SiCf/SiC composites and nickel-based superalloy heterogeneous brazed joints. A variety of Ag-based brazing fillers were used to realize the homogeneous and heterogeneous brazing of SiCf/SiC composites. SEM and thermodynamic calculations were used to explore the effects of different fillers on the microstructure and shear strength of heterogeneous brazed joints and reveal the microstructure and phase regulation mechanism of heterogeneous joints. Through the multi-interface characterization and analysis of the microstructure of the joint, the differences between the homogeneous and heterogeneous joints were compared and analyzed, and the regulatory effect of the active element Ti on the microstructure of the SiCf/SiC composite joints was revealed. The AgCuTi heterogeneous brazed joints formed a TiC layer to strengthen the weak interface on the side of the SiCf/SiC composites, and the microstructure of the joint was uniform and defect-free. Due to the violent reaction of Ni, Si and Pd elements, there were many brittle phases and cracks in the heterogeneous joints of AuCuPd filler. The strength of AgCuTi heterogeneous brazed joint was 59 MPa, which was twice that of AgCuPd, and was similar to that of homogeneous joints. The active element Ti can effectively improve the wettability and heterogeneous interface connectivity of SiCf/SiC composites, and the microstructure of the joint is uniform with high properties. |
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