黄玲玲,钟素娟,孙元,等.Ni元素对B60AgCuSnIn钎料微观组织及接头性能的影响[J].精密成形工程,2025,17(3):110-115.
HUANG Lingling,ZHONG Sujuan,SUN Yuan,et al.Effect of Ni Element on Microstructure and Joint Properties of BAg60CuSnIn Filler[J].Journal of Netshape Forming Engineering,2025,17(3):110-115. |
| Ni元素对B60AgCuSnIn钎料微观组织及接头性能的影响 |
| Effect of Ni Element on Microstructure and Joint Properties of BAg60CuSnIn Filler |
| 投稿时间：2025-02-11 |
| DOI：10.3969/j.issn.1674-6457.2025.03.012 |
| 中文关键词: 银钎料 真空条件 熔化特性 微观组织 接头性能 |
| 英文关键词: silver fillers vacuum melting characteristics microstructure joint performance |
| 基金项目:中原学者获资助项目;河南省重点研发专项项目(241111233300);中原科技创新领军人才项目(244200510023) |
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| 中文摘要: |
| 目的 探究不同Ni添加量对B60AgCuSnIn钎料合金熔化特性、微观组织及钎焊接头强度的影响规律，为生产一种新型中温银钎料提供指导。方法 通过真空感应加热熔炼方法制备5种不同成分的B60AgCuSnIn-xNi钎料合金，通过熔化特性曲线(DSC)，分析微量元素Ni的添加对钎料合金焊接性能的影响;通过金相显微镜(OM)、X射线衍射仪(XRD)、扫描电子显微镜(SEM)等表征手段，研究微量元素Ni的添加对钎料合金微观组织及物相组成变化的影响。结果 随着Ni元素添加量的增加，钎料固液相线温度有所升高，当Ni添加量(质量分数)超过0.75%时，钎料的熔化温度区间增大。B60AgCuSnIn-xNi钎料合金凝固组织主要由灰白色富Ag相、块状或树枝状富Cu相和少量Cu3Sn金属间化合物组成。在810 ℃下，当Ni添加量(质量分数)为0.75%时，接头强度最大，为192 MPa。结论 Ni元素的添加提高了钎料的固液相线，改变了钎料的微观组织形貌，但未改变其物相组成。添加Ni元素的钎料接头致密度得到了改善，接头强度得到了提高。 |
| 英文摘要: |
| The work aims to explore the effects of different Ni additions on the melting characteristics, microstructure and strength of brazed joints of B60AgCuSnIn fillers, and to provide guidance for the production of a new type of medium temperature silver fillers. Five kinds of B60AgCuSnIn-xNi fillers with different compositions were prepared by vacuum induction heating melting. The effect of trace element Ni addition on the welding performance of fillers was analyzed by melting characteristic curve (DSC). The effects of trace element Ni addition on the microstructure and phase composition of the fillers were studied by means of metallographic microscope (OM), X-ray diffractometer (XRD) and scanning electron microscope (SEM). The results showed that, with the addition of Ni elements, the solid-liquid phase temperature of the solder increased. When the addition of Ni exceeded 0.75wt.%, the melting temperature range of the solder increased. The solidification structure of B60AgCuSnIn-xNi fillers alloy was mainly composed of gray-white Ag-rich phases, massive or dendritic Cu-rich phases and a small amount of Cu3Sn intermetallic compound. At 810 ℃, the maximum strength of the joint was 192 MPa when the addition of Ni was 0.75wt.%. In conclusion, the addition of Ni elements increases the solid-liquid phase line and changes the microstructure of the fillers, but does not change its phase composition. The addition of Ni elements improves the density of the joint and improves the strength of the joint. |
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