何萌,贾淑果,朱倩倩,等.阴极钛材表面处理工艺对其表面状态及铜离子电沉积初期行为的影响[J].精密成形工程,2024,16(9):56-64.
HE Meng,JIA Shuguo,ZHU Qianqian,et al.Influence of Surface Treatment Processes on Surface State of Cathodic Titanium Materials and Initial Behavior of Copper Ion Electrodeposition[J].Journal of Netshape Forming Engineering,2024,16(9):56-64. |
| 阴极钛材表面处理工艺对其表面状态及铜离子电沉积初期行为的影响 |
| Influence of Surface Treatment Processes on Surface State of Cathodic Titanium Materials and Initial Behavior of Copper Ion Electrodeposition |
| 投稿时间：2024-05-21 |
| DOI：10.3969/j.issn.1674-6457.2024.09.006 |
| 中文关键词: 铜离子电沉积 钛阴极 表面处理工艺 粗糙度 形核行为 |
| 英文关键词: electrodeposition of copper ions cathode titanium surface treatment processes roughness nucleation behavior |
| 基金项目:国家重点研发计划(2021YFB3400800);河南省科技攻关项目(232102231017);河南省科技研发计划联合基金重点项目(225200810026);河南省重点研发专项(231111241000);河南省中原学者工作站资助项目(224400510025) |
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| 中文摘要: |
| 目的 研究表面处理工艺对钛材表面状态的影响，进一步探究阴极钛材表面状态对铜离子电沉积初期形核行为的影响。方法 利用砂纸研磨、机械/电解抛光、化学腐蚀等不同的表面处理工艺，制备出不同表面状态的钛材，对钛材的表面粗糙度和形貌分别进行测试和扫描电镜观察。以不同表面状态的钛材作为阴极，进行铜离子的电沉积实验，对初始沉积层组织进行扫描电镜观察，并统计铜晶核的尺寸、覆盖率。结果 砂纸研磨的钛材表面粗糙度最大，随着砂纸目数的增加，粗糙度降低，划痕变得细密，沉积的铜晶核尺寸较小、分布均匀、面覆盖率较高;抛光可显著降低钛材表面粗糙度，电解抛光的粗糙度最低，但铜晶核难以牢固附着;化学腐蚀会在钛材表面残留金属颗粒或暴露晶界组织，沉积的铜晶核分布不均匀且易发生团簇。结论 铜离子的初始沉积形核行为与阴极钛材的表面粗糙度和缺陷状态密切相关，采用3000#~4000#砂纸精细研磨的方式，可使钛材表面粗糙度Rz保持在1~1.2 μm，且表面覆盖有高密度均匀细小的划痕缺陷，最有利于铜离子的高密度均匀形核。 |
| 英文摘要: |
| The work aims to analyze the effects of surface treatment processes on the surface state of titanium materials, and further explore the influence of the surface state of cathodic titanium materials on the nucleation behavior of copper ion electrodeposition in the initial stage. Titanium materials of different surface states were prepared by varying the parameters of surface treatment processes such as sandpaper grinding, mechanical polishing, electrolytic polishing, and chemical etching. The surface roughness of the titanium materials was measured, and their surface morphology was analyzed by scanning electron microscopy. Then, copper ion electrodeposition experiments were conducted with titanium materials of different surface states as cathodes. The morphology of the initial deposition layer was observed by scanning electron microscopy, and the size and coverage of copper nuclei were statistically analyzed. Titanium materials treated with sandpaper grinding exhibited the highest surface roughness. As the mesh number of sandpaper increased, the surface roughness of the titanium materials decreased, and the scratches became finer and denser. Correspondingly, the copper nuclei were smaller, more evenly distribute, and had higher surface coverage. Polishing treatments significantly reduced the surface roughness of the titanium materials, with electrolytic polishing resulting in the lowest roughness. However, the distribution of copper nuclei was very uneven for electrolytic polishing. Etching treatment would leave metal residues or exposed grain boundary structures on the surface of the titanium materials, resulting in uneven distribution and clustering of copper nuclei. The nucleation behavior of copper ion during initial deposition is closely related to the surface roughness and defect status of cathodic titanium material. Using fine grinding with 3000# to 4000# grit sandpaper can keep the surface roughness Rz of the titanium material between 1 and 1.2 μm, and the surface is covered with high-density, uniformly fine scratch defects, which is most conducive to the high-density uniform nucleation of copper ions. |
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