梁海成,惠文芃,陈帅峰,等.固溶处理及工艺路径对Cu-Ni-Si-Co合金板材性能的影响[J].精密成形工程,2024,16(7):144-152.
LIANG Haicheng,HUI Wenpeng,CHEN Shuaifeng,et al.Effect of Solid Treatment and Process Route on Properties of Cu-Ni-Si-Co Alloy Sheet[J].Journal of Netshape Forming Engineering,2024,16(7):144-152. |
| 固溶处理及工艺路径对Cu-Ni-Si-Co合金板材性能的影响 |
| Effect of Solid Treatment and Process Route on Properties of Cu-Ni-Si-Co Alloy Sheet |
| 投稿时间：2024-05-25 |
| DOI：10.3969/j.issn.1674-6457.2024.07.012 |
| 中文关键词: Cu-Ni-Si-Co合金 固溶处理 工艺路径 抗拉强度 导电率 |
| 英文关键词: Cu-Ni-Si-Co alloy solution treatment process route tensile strength electrical conductivity |
| 基金项目:国家自然科学基金(52105412) |
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| 摘要点击次数: 600 |
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| 中文摘要: |
| 目的 系统探究了不同固溶温度及不同冷轧时效工艺对C7035合金力学性能与导电性能的影响规律。方法 针对C7035合金进行了不同温度的固溶处理，并进行了冷轧以及不同温度的时效处理。对比一次时效的力学性能与电学性能差异性，并优化工艺路径。选择性能较为优异的样品观察其微观组织以及析出相。结果 提高固溶温度可显著提升一次冷轧-时效合金的硬度、强度以及导电性，其中性能较为优异的工艺参数为960 ℃固溶1 h、冷轧90%、450 ℃时效3 h，对应板材的维氏硬度、抗拉强度及导电率分别为241.2HV0.1、777 MPa、48.6%IACS。工艺优化后，较优异的工艺参数为960 ℃固溶1 h、冷轧90%、450 ℃预时效0.5 h、冷轧50%、450 ℃时效2 h，对应板材的维氏硬度、抗拉强度及导电率分别为252.8HV0.1、787 MPa、41.2%IACS。结论 固溶温度越高，溶质原子溶入基体的数量越多，固溶后能观察到的第二相越少。960 ℃固溶后一次冷轧-时效的强度较高，与880 ℃固溶后一次冷轧-时效后相比，强度提高了约100 MPa，二次冷轧时效后，强度有进一步的提升。 |
| 英文摘要: |
| The work aims to explore the effects of different solution temperature and cold rolling aging processes on the mechanical and electrical properties of C7035 alloy. Solution treatment, cold rolling and aging treatment were carried out for C7035 alloy at different temperature. The difference of mechanical and electrical properties of primary aging was compared, and the process route was optimized. The microstructure and precipitated phase were observed in the state with better performance. Increasing the solution temperature could significantly improve the hardness, strength and electrical conductivity of single cold-rolled and aging alloy, among which the better performance of the process parameters were solution treatment at 960 ℃ for 1 h, 90% cold rolling, aging at 450 ℃ for 3 h. The Vickers hardness, tensile strength and electrical conductivity of the corresponding plates were 241.2HV0.1, 777 MPa and 48.6%IACS, respectively. After the process optimization, the best process parameters were solution treatment at 960 ℃ for 1 h, 90% cold rolling, preaging at 450 ℃ for 0.5 h, 50% cold rolling, aging at 450 ℃ for 2 h, and the Vickers hardness, tensile strength and electrical conductivity of the corresponding plates was 252.8HV0.1, 787 MPa, 41.2%IACS. The higher the solution temperature is, the more solute atoms dissolve into the matrix, and the less second phase can be observed after solution. The strength of single cold roll-aging after solution at 960 ℃ is higher than that of single cold roll-aging after solution treatment at 880 ℃ by about 100 MPa, and the strength is further improved after secondary cold rolling and aging. |
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