文章摘要
曹华东,蒋刘杰,田谧哲,等.电子封装用清洗剂的研究进展[J].精密成形工程,2021,13(1):146-152.
CAO Hua-dong,JIANG Liu-jie,TIAN Mi-zhe,et al.Progress of Cleaning Agents for Electronic Assembly[J].Journal of Netshape Forming Engineering,2021,13(1):146-152.
电子封装用清洗剂的研究进展
Progress of Cleaning Agents for Electronic Assembly
投稿时间:2019-12-05  
DOI:10.3969/j.issn.1674-6457.2021.01.020
中文关键词: 电子封装  水基清洗剂  清洗机理
英文关键词: electronic packaging  water-based cleaning agent  mechanism
基金项目:国家自然科学基金(61774066,61974013);重庆市教委科学技术研究项目(KJQN201803701);重庆市重点产业共性关键技术创新专项(cstc2016zdcy-ztzx0047,cstc2016zdcy-ztzx0036)
作者单位
曹华东 重庆理工大学 材料科学与工程学院重庆 400054 
蒋刘杰 重庆理工大学 材料科学与工程学院重庆 400054 
田谧哲 重庆理工大学 材料科学与工程学院重庆 400054 
夏大权 重庆理工大学 材料科学与工程学院重庆 400054 
甘贵生 重庆理工大学 材料科学与工程学院重庆 400054
重庆理工大学 特种焊接材料与技术重庆市高校工程研究中心重庆 400054 
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中文摘要:
      随着电子信息产业的蓬勃发展,三维封装技术和超摩尔定律随即诞生,极小的封装间距对电子产品的清洗提出了崭新要求。综述了电子封装用水基清洗剂的组成和作用机理,结合国内外电子封装用水基清洗剂的研究现状,着重介绍了水基清洗剂研制过程中成分、配比和浓度三者的关系,阐述了目前电子封装用水基清洗剂依旧存在适用范围小、兼容性差、难降解等问题,并探讨了未来电子封装用水基清洗剂的发展趋势。开发并推广一种绿色、高效和低成本电子封装用水基清洗剂尤为重要。
英文摘要:
      With the vigorous development of the electronic information industry, three-dimensional packaging technology and Super Moore's law were born. Minimal packaging spacing put forward new requirements for cleaning electronic products. The work reviewed the composition and mechanism of water-based cleaning agent for electronic packaging. Based on the research status of water-based cleaning agents for electronic packaging at home and abroad, the relationship of composition, proportion and concentration in development of water-based cleaning agent was introduced. The problems such as small application scope, poor compatibility and difficult degradation of water-based cleaning agent for electronic packaging were illustrated. The development trend of water-based cleaning agent for electronic packaging was also discussed. It was very important to develop and promote a green, efficient and low-cost water-based cleaning agent for electronic packaging.
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