周漪清,陈平.高端精密超薄均热板研究现状及发展趋势[J].精密成形工程,2020,12(4):118-125.
ZHOU Yi-qing,CHEN Ping.Research Status and Development Trend of High Precision Ultra-thin Vapor Chamber[J].Journal of Netshape Forming Engineering,2020,12(4):118-125. |
| 高端精密超薄均热板研究现状及发展趋势 |
| Research Status and Development Trend of High Precision Ultra-thin Vapor Chamber |
| 投稿时间：2020-05-11 修订日期：2020-07-10 |
| DOI：10.3969/j.issn.1674-6457.2020.04.014 |
| 中文关键词: 5G通讯 超薄均热板 轻质材料 扩散焊 |
| 英文关键词: 5G communication ultra-thin vapor chamber light material diffusion welding |
| 基金项目:2017广东普通高校特色创新项目（粤教科函[2018]64号）；江门市2018、2019年科技计划（江科[2018]202号，江科[2019]185号） |
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| 中文摘要: |
| 超薄均热板广泛应用于移动电子产品，随着5G产品的普及，电子产品功率器件的热流密度越来越大，超薄均热板成了移动电子产品导热的关键器件。综述了当前超薄均热板的发展现状，以及超薄均热板研究过程中遇到的问题。还论述了未来超薄均热板的发展方向是轻质材料和新的制造工艺应用，轻质材料超薄均热板在未来将取代铜质均热板，届时移动电子产品将迎来散热器的升级换代。 |
| 英文摘要: |
| Ultra-thin vapor chamber is widely used in mobile electronic products. With the popularity of 5G products, the heat flux density of power devices of electronic products is increasing. Ultra-thin vapor chamber has become the key device of heat transfer of mobile electronic products. The development status of ultra-thin vapor chamber and the problems encountered in the research process of ultra-thin vapor chamber were reviewed. The development direction of ultra-thin vapor chamber in the future is light material and new manufacturing technology application. In the future, the ultra-thin vapor chamber made of light material will replace the copper vapor chamber. At that time, the mobile electronic products will usher in the upgrading of radiator. |
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