程翰林,刘聪,明忠正,等.SAC305无铅BGA凸点回流工艺研究[J].精密成形工程,2019,11(1):86-92.
CHENG Han-lin,LIU Cong,MING Zhong-zheng,et al.Reflow Soldering on SAC305 Lead-Free BGA Bump[J].Journal of Netshape Forming Engineering,2019,11(1):86-92. |
| SAC305无铅BGA凸点回流工艺研究 |
| Reflow Soldering on SAC305 Lead-Free BGA Bump |
| 投稿时间：2018-12-03 修订日期：2019-01-10 |
| DOI：10.3969/j.issn.1674-6457.2019.01.014 |
| 中文关键词: SAC305 剪切强度 显微组织 方差分析 |
| 英文关键词: SAC305 shear strength analysis microstructures analysis of variance |
| 基金项目:重庆理工大学2018科研立项（KLA18001）；2018年大学生创新创业训练计划项目立项（2018CX024） |
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| 中文摘要: |
| 目的 优化不同直径的SAC305无铅BGA凸点回流曲线。方法 通过力学性能测试得到优化前后不同直径凸点的剪切强度，对其进行方差分析；通过切片制样，对比优化前后不同直径凸点的显微组织变化。结果 Φ0.3~0.6 mm凸点的回流曲线峰值温度均稳定在265 ℃最佳，时间维持65 s最宜。当Φ0.3~0.6 mm凸点的回流曲线保温区时间分别延长10, 10, 16, 22 s后，凸点的缺陷明显减少，剪切强度的平均值较原曲线分别减少了14.3, 12.17, 8.22, 5.7 MPa，剪切强度有8%~17%的降低，剪切强度的离散程度有30%~60%的减少。结论 优化后，凸点的缺陷显著减少，剪切强度略有下降，但凸点一致性得到了明显的提升。 |
| 英文摘要: |
| The work aims to optimize the reflow soldering process of SAC305 lead-free BGA ball with different diameters. The shear strength of bumps with different diameters before and after optimization was obtained by mechanical property test, and the variance analysis was carried out. The microstructure changes of bumps with different diameters before and after optimization were compared by slice preparation. The peak temperature of the reflow curve of Φ0.3~0.6 mm bumps was stable at 265 ℃, and the time was maintained at 65 s. When the reflow curve of Φ0.3~0.6 mm bumps was extended by 10, 10, 16, 22 s respectively, the defects of solder bump were reduced significantly, the average shear strength decreased by 14.3, 12.17, 8.22, 5.7 MPa compared with the original curve, the shear strength was reduced by 8%~17% and the dispersion of shear strength was reduced by 30%~60%. After optimization, the bump defects are reduced obviously, the shear strength of the solder bump decreases slightly, but the consistency is improved significantly. |
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