文章摘要
钟轶宁,王惠敏,刘德贵,等.湿法喷丸工艺有限元分析[J].精密成形工程,2018,10(4):79-84.
ZHONG Yi-ning,WANG Hui-min,LIU De-gui,et al.Finite Element Simulation of Wet Peening Process[J].Journal of Netshape Forming Engineering,2018,10(4):79-84.
湿法喷丸工艺有限元分析
Finite Element Simulation of Wet Peening Process
投稿时间:2018-03-16  修订日期:2018-07-10
DOI:10.3969/j.issn.1674-6457.2018.04.012
中文关键词: 湿喷丸  覆盖率  数值模拟  残余应力  粗糙度
英文关键词: wet shot peening  coverage  numerical simulation  residual stress  roughness
基金项目:国家自然科学基金(51405059)
作者单位
钟轶宁 大连理工大学 材料科学与工程学院辽宁 大连 116024 
王惠敏 大连理工大学 材料科学与工程学院辽宁 大连 116024 
刘德贵 北京航空制造工程研究所北京 100024 
周文龙 大连理工大学 材料科学与工程学院辽宁 大连 116024 
付雪松 大连理工大学 材料科学与工程学院辽宁 大连 116024 
李志强 北京航空制造工程研究所北京 100024 
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中文摘要:
      目的 分析TC4钛合金的湿喷丸强化过程。方法 利用ABAQUS有限元软件中的CEL方法以及随机分布函数建立弹丸随机分布的湿喷丸冲击强化模型,研究喷丸覆盖率对残余应力场和表面粗糙度的影响规律,进行TC4钛合金板材的湿喷丸强化实验,对比验证模拟结果。结果 表面粗糙度随着喷丸覆盖率的增加而变大;对于残余应力场,随着覆盖率从50%增加到100%,最大残余压应力值和其所处位置的深度均增加。当覆盖率增加至200%,最大残余压应力值不再增加。不同喷丸覆盖率下表面残余应力值基本相同。经对比验证,构建的有限元模型的仿真结果与湿喷丸实验规律相一致。结论 湿喷丸模型能够较好地模拟湿喷丸强化后板材表层残余压应力场和表面粗糙度的变化规律。
英文摘要:
      The paper aims to analyze wet peening process of TC4 alloy. The model of shot peening was established with the CEL method in ABAQUS software and shot random distribution established by the random distribution function. The influences of wet shot peening coverage on the surface roughness and residual stress in the modified layer were investigated. Meanwhile the wet peening experiments were carried out, and the experimental results were compared with the simulation results. The surface roughness increased with the increase of coverage; as the coverage increased from 50% to 100%, the maximum compressive residual stress and the depth of it increased; when the coverage increased to 200%, the maximum value didn’t increase anymore; the surface residual stress was approximately the same under different coverage. The simulation results were in good agreement with experimental results. The shot peening model can well simulate the variation tendency of the residual stress field and the surface roughness of the wet-peened plate.
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