黄文超,甘贵生,唐明,等.纳米 Ni 颗粒对 Sn0 . 65 Cu 亚共晶钎料润湿性和抗氧化性的影响[J].精密成形工程,2013,5(1):16-19.
HUANG Wen-chao,GAN Gui-sheng,TANG Ming,et al.The Effcet of Nano-Ni Particles on the Wettability and Oxidation Resistance of Sn0 . 65 Cu Hypoeutectic Solder[J].Journal of Netshape Forming Engineering,2013,5(1):16-19. |
| 纳米 Ni 颗粒对 Sn0 . 65 Cu 亚共晶钎料润湿性和抗氧化性的影响 |
| The Effcet of Nano-Ni Particles on the Wettability and Oxidation Resistance of Sn0 . 65 Cu Hypoeutectic Solder |
| 投稿时间：2012-07-12 修订日期：2012-12-01 |
| DOI：10.3969/j.issn.1674-6457.2013.01.005 |
| 中文关键词: Sn0 . 65 Cu 亚共晶钎料 纳米 Ni 颗粒 润湿性 抗氧化性 |
| 英文关键词: Sn0. 65Cu hypo-eutectic solder nano-Ni particles wettability oxidation resistance |
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| 中文摘要: |
| 在 Sn0 . 65 Cu 亚共晶钎料中掺入纳米 Ni 颗粒,研究其对钎料润湿性及抗氧化性的影响。 当w( Ni)= 0 . 1% 时润湿力最大,为 3 . 29 mN,润湿时间为 1 . 01 s。 随着 Ni 含量的增加( w( Ni ) <0 . 7% ) 润湿力逐渐减弱,润湿时间增加。 纳米 Ni 颗粒会增强钎料的抗氧化性,当 w( Ni) = 0 . 7% 时抗氧化性最好。 |
| 英文摘要: |
| After nano-Ni particles were mixed to Sn0. 65Cu hypoeutectic solder, the wettability and oxidation resistance of solders were studied. When w( Ni) was 0. 1% , the maximum wetting force was 3. 29 mN and wetting time was 1. 01 s. The wetting force was gradually weakened and the wetting time increased by increasing the content of Ni ( w( Ni) <0. 7% ) . Nano-Ni particles enhanced the oxidation resistance of solders. when w( Ni) was 0. 7% , the oxidation resistance of solders was the best. |
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